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1    
Real-time profiling of reflow process in VPS chamber 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:29  Issue:1  Page:42-48  

Livovsky Lubomir;   Pietrikova Alena;  

来源数据库:[Web of Science, Scopus, Science Database]         被引频次:22

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2    
Vapour phase soldering (VPS) technology: a review 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:3  Page:146-156  

Illés Balázs;   Géczy Attila;   Medgyes Bálint;   Harsányi Gábor;  

来源数据库:[Web of Science, Scopus]         被引频次:0

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3    
Voids investigation in solder joints performed with vapour phase soldering (VPS) 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:26  Issue:1  Page:8-11  

Kinga Synkiewicz Beata;   Skwarek Agata;   Witek Krzysztof;  

来源数据库:[Web of Science, Scopus, Science Database]         被引频次:41

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4    
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:ahead-of-print  Issue:ahead-of-print  

Liu Yun;   Yu Weiyuan;   Sun Xuemin;   Wang Fengfeng;  

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5    
Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:ahead-of-print  Issue:ahead-of-print  

Mayappan Ramani;   Salleh Amirah;   Tokiran Nurul Atiqah;   Awang N.A;  

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6    
A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:ahead-of-print  Issue:ahead-of-print  

Aamir Muhammad;   Muhammad Riaz;   Tolouei-Rad Majid;   Giasin Khaled;   Silberschmidt Vadim V;  

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7    
Filling efficiency of flip-chip underfill encapsulation process 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:ahead-of-print  Issue:ahead-of-print  

Ng Fei Chong;   Abas Mohamad Aizat;   Abdullah Mohd Zulkifly;  

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8    
A method for optimizing stencil cleaning time in solder paste printing process 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:233-239  

Yu JiangYou;   Cao Le;   Fu Hao;   Guo Jun;  

来源数据库:Web of Science         被引频次:0

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9    
Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:227-232  

Guo Mengjiao;   Sun F;   Yin Zuozhu;  

来源数据库:Web of Science         被引频次:0

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10    
Study on the strength of diameter-reducing solder balls by shear and pull tests 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:240-249  

Yu Kehang;   Yang Chen;   Wang Jun;   Yu Jiabo;   Yang Yi;  

来源数据库:Web of Science         被引频次:0

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11    
Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:193-202  

Zhang Qiaoran;   Zehri Abdelhafid;   Liu Jiawen;   Ke Wei;   Huang Shirong;   ...

来源数据库:Web of Science         被引频次:0

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12    
Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phones 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:203-210  

Tang Jie;   Gong Yi;   Yang Zhen-Guo;  

来源数据库:Web of Science         被引频次:0

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13    
Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:250-260  

Aamir Muhammad;   Tolouei-Rad Majid;   Din Israr Ud;   Giasin Khaled;   Vafadar Ana;  

来源数据库:Web of Science         被引频次:0

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14    
Applying data mining methodology to establish an intelligent decision system for PCBA process 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:271-278  

Huang Chien-Yi;   Ruano Marvin;   Chen Ching-Hsiang;   Greene Christopher;  

来源数据库:Web of Science         被引频次:0

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15    
Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:211-220  

Ahmad Ibrahym;   Abu Seman Anasyida;   Mohamad Ahmad Azmin;  

来源数据库:Web of Science         被引频次:0

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16    
The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:261-270  

Chen Guang;   Li Jiqiang;   Kuang Xinwen;   Wu Yaofeng;   Wu Fengshun;  

来源数据库:Web of Science         被引频次:0

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17    
Transient liquid phase bonding in the Cu-Sn system 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:4  Page:221-226  

Hosseinzaei Behnam;   Kiani Rashid Ali Reza;  

来源数据库:Web of Science         被引频次:0

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18    
Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:ahead-of-print  Issue:ahead-of-print  

Han Bangyao;   Sun Fenglian;   Li Tianhui;   Liu Yang;  

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19    
Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:ahead-of-print  Issue:ahead-of-print  

Asghar Rafiq;   Rehman Faisal;   Aman Ali;   Iqbal Kashif;   Nawaz Agha Ali;  

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20    
Stress analysis of pressure-assisted sintering for the double-side assembly of power module 期刊论文

Soldering & Surface Mount Technology     ISSN:0954-0911  Volume:31  Issue:1  Page:20-27  

Liu Yang;   Zhang Hao;   Wang Lingen;   Fan Xuejun;   Zhang Guoqi;   ...

来源数据库:[Web of Science, Scopus]         被引频次:3

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